Product Platform

SiC Device
Platform.

SiCBerg provides a broad portfolio of silicon carbide power devices engineered to support a wide spectrum of high-performance electrical systems.

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Live Performance Benchmarks
1700V

Voltage Capability

200 kHz

Max Switching Frequency

175°C

Max Junction Temp

15

stats.lowestRDSon

99.5%

stats.switchingingEfficiency

600A

stats.maxModuleCurrent

Across the full SiCBerg SiC device portfolio
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Voltage Rating

Current Range

Application

SiC MOSFETs

High-Performance
Switching Devices

High-performance MOSFET devices designed for ultra-efficient switching, reduced conduction losses, and improved thermal stability across demanding applications.

Voltage Ratings

650V
1200V
1700V

Key Specifications

RDS(on): As low as 15 mΩ (1200V class)
Switching Frequency: Up to 200 kHz
Max Junction Temp: 175°C
Package Types: TO-247, TO-220, D2PAK, SOT-227

Key Features

Ultra-low switching losses
High-speed switching capability
Excellent thermal conductivity
Avalanche-rated for rugged applications
Low gate charge for efficient drive
SiC MOSFET
SiC Schottky Diode
SiC Schottky Barrier Diodes

Ultra-Fast
Rectification

Advanced SBD devices enabling faster switching speeds, lower reverse recovery losses, and superior efficiency in modern power conversion systems.

Voltage Ratings

600V
1200V
1700V

Key Specifications

Forward Voltage: As low as 1.3V @ 25A
Reverse Recovery: Near-zero recovery time
Current Ratings: 5A to 100A
Package Types: TO-220, TO-247, D2PAK, DPAK

Key Features

Zero reverse recovery charge
Temperature-independent switching
Positive temperature coefficient
Surge current capability
High-frequency operation
SiC Power Modules

Integrated Power
Solutions

Integrated module architectures designed for higher power applications across industrial equipment, grid infrastructure, and energy systems.

Power Range

10 kW
50 kW
100 kW
250 kW+

Key Specifications

Topology Options: Half-bridge, full-bridge, 3-phase
Isolation Voltage: Up to 4 kV
Thermal Resistance: As low as 0.02 K/W
Package Formats: Standard and custom baseplate designs

Key Features

Optimized thermal management
Integrated gate drivers available
Low parasitic inductance
Compact system footprint
Scalable power architectures
SiC Power Module
Custom Solutions

Application-Aligned Solutions

SiCBerg works closely with customers to align device architectures with specific system requirements, ensuring optimal performance, efficiency, and reliability.

Requirements Analysis

Deep technical engagement to understand system-level needs and constraints.

Device Optimization

Custom device architectures tailored to specific application requirements.

Validation & Deployment

Rigorous testing and qualification to ensure reliable production deployment.

Technical Comparison

Device Specifications

Key parameters across SiCBerg's SiC device portfolio.

ParameterSiC MOSFETsSiC Schottky Barrier DiodesSiC Power Modules
Voltage Range650V – 1700V600V – 1700V1200V – 3300V
Current Range10A – 200A5A – 100A50A – 600A
Max Junction Temp175°C175°C175°C
Switching FrequencyUp to 200 kHzN/AUp to 100 kHz
Package TypesTO-247, TO-220, D2PAKTO-220, TO-247, DPAKCustom baseplate
SiCBerg

European silicon carbide power semiconductor platform for next-generation electrical systems.

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